Full Rja stack: Rjc + Rcs (TIM) + Rsa (heatsink) · Junction temperature · Thermal margin
Select your TIM or enter a custom Rcs value. Rcs = t / (k × A) where t = bond line thickness, k = conductivity, A = contact area.
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| TIM Type | Conductivity k (W/m·K) | Typical BLT | Rcs @ 100mm², 0.1mm | Best For |
|---|---|---|---|---|
| Thermal Grease (standard) | 3–6 | 0.05–0.15mm | 0.17–0.33 °C/W | Heatsinks, processors |
| Phase Change Material | 3–8 | 0.05–0.1mm | 0.13–0.33 °C/W | High performance, reflow |
| Thermal Pad (soft) | 3–10 | 0.5–2.0mm | 0.50–3.33 °C/W | Gap filling, PCB boards |
| Indium Foil | 81 | 0.05–0.25mm | 0.006–0.03 °C/W | High power, space-grade |
| Graphite Sheet | 5–10 (z-axis) | 0.1–0.5mm | 0.10–1.00 °C/W | Spreading, flex apps |
| Epoxy (thermally conductive) | 1–3 | 0.05–0.2mm | 0.17–2.00 °C/W | Permanent bond, structural |
| Dry / No TIM | ~0.03 (air) | N/A | 33+ °C/W | Low power only |
| Component Type | Typical Tjmax | Notes |
|---|---|---|
| General purpose ICs | 125°C | Most commercial semiconductors |
| High-reliability / MIL-spec ICs | 150°C | Automotive, defense grade |
| Power MOSFETs / IGBTs | 150–175°C | Check per-device datasheet |
| LEDs (high power) | 125–150°C | Lumen maintenance affects lower limit |
| Electrolytic capacitors | 85–105°C | Lifetime-limiting component |
| Avionics / space grade | 125°C | Typically derated to 110°C max |