// MechanicalAI Engineering — Thermal Analysis Tools

Junction-to-Ambient
Thermal Resistance Calculator

Full Rja stack: Rjc + Rcs (TIM) + Rsa (heatsink) · Junction temperature · Thermal margin

Tj = Tamb + P × Rja   |   Rja = Rjc + Rcs + Rsa   |   Rcs = t / (k × A)   |   Margin = Tjmax − Tj
Component Parameters
Watts (W) — from datasheet or power budget
°C/W — from component datasheet (θjc)
°C — from datasheet (typically 125°C or 150°C)
Environment Parameters
°C — worst-case operating ambient
°C/W — heatsink thermal resistance (0 if no heatsink)
°C/W — junction-to-board (for PCB conduction path)
TIM — Thermal Interface Material (Rcs)

Select your TIM or enter a custom Rcs value. Rcs = t / (k × A) where t = bond line thickness, k = conductivity, A = contact area.

°C/W — custom TIM resistance (overrides selection above)
mm² — component footprint / heatsink contact area
mm — compressed thickness of TIM
Enter inputs above and click Calculate →
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TIM Thermal Conductivity Reference
TIM Type Conductivity k (W/m·K) Typical BLT Rcs @ 100mm², 0.1mm Best For
Thermal Grease (standard)3–60.05–0.15mm0.17–0.33 °C/WHeatsinks, processors
Phase Change Material3–80.05–0.1mm0.13–0.33 °C/WHigh performance, reflow
Thermal Pad (soft)3–100.5–2.0mm0.50–3.33 °C/WGap filling, PCB boards
Indium Foil810.05–0.25mm0.006–0.03 °C/WHigh power, space-grade
Graphite Sheet5–10 (z-axis)0.1–0.5mm0.10–1.00 °C/WSpreading, flex apps
Epoxy (thermally conductive)1–30.05–0.2mm0.17–2.00 °C/WPermanent bond, structural
Dry / No TIM~0.03 (air)N/A33+ °C/WLow power only
Typical Component Tjmax Values
Component TypeTypical TjmaxNotes
General purpose ICs125°CMost commercial semiconductors
High-reliability / MIL-spec ICs150°CAutomotive, defense grade
Power MOSFETs / IGBTs150–175°CCheck per-device datasheet
LEDs (high power)125–150°CLumen maintenance affects lower limit
Electrolytic capacitors85–105°CLifetime-limiting component
Avionics / space grade125°CTypically derated to 110°C max